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Home > Products > Thermal > Heat Sinks > ///HSB08-212106

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HSB08-212106Quantity:231

Part No HSB08-212106
Manufacturer CUI Devices
Description HEAT SINK, BGA, 21 X 21 X 6 MM
Lead Free Status / RoHS Status Contains lead / RoHS compliant
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Specifications

ShapeSquare, Pin Fins
PackageBox
MaterialAluminum Alloy
Product StatusActive
Fin Height0.236" (6.00mm)
SeriesHSB
TypeTop Mount
Thermal Resistance @ Forced Air Flow9.70°C/W @ 200 LFM
Length0.827" (21.00mm)
Thermal Resistance @ Natural25.40°C/W
Material FinishBlack Anodized
Attachment MethodAdhesive (Not Included)
Width0.827" (21.00mm)
Diameter-
Power Dissipation @ Temperature Rise3.0W @ 75°C
Package CooledBGA

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