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See Product Specifications for product details.
Buy HSB08-212106 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB08-212106 with confidence from acme-chip.com, 1 Year Warranty
HSB08-212106Quantity:231
Part No | HSB08-212106 |
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Manufacturer | CUI Devices |
Description | HEAT SINK, BGA, 21 X 21 X 6 MM |
Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
Datasheets |
Specifications
Shape | Square, Pin Fins |
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Package | Box |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.236" (6.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 9.70°C/W @ 200 LFM |
Length | 0.827" (21.00mm) |
Thermal Resistance @ Natural | 25.40°C/W |
Material Finish | Black Anodized |
Attachment Method | Adhesive (Not Included) |
Width | 0.827" (21.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
Package Cooled | BGA |
Introduce
We can supply HSB08-212106 , send us a request quote to request HSB08-212106 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HSB08-212106.The price and lead time for HSB08-212106 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HSB08-212106.We look forward to working with you to establish long-term relations of cooperation