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See Product Specifications for product details.
Buy HSB02-101007 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB02-101007 with confidence from acme-chip.com, 1 Year Warranty
HSB02-101007Quantity:5536
| Part No | HSB02-101007 |
|---|---|
| Manufacturer | CUI Devices |
| Description | HEAT SINK, BGA, 10 X 10 X 7 MM |
| Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
| Datasheets |
Specifications
| Shape | Square, Pin Fins |
|---|---|
| Package | Box |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.275" (7.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
| Length | 0.394" (10.00mm) |
| Thermal Resistance @ Natural | 37.90°C/W |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive (Not Included) |
| Width | 0.394" (10.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
| Package Cooled | BGA |
Introduce
We can supply HSB02-101007 , send us a request quote to request HSB02-101007 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HSB02-101007.The price and lead time for HSB02-101007 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HSB02-101007.We look forward to working with you to establish long-term relations of cooperation
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