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See Product Specifications for product details.
Buy HSB03-121218 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB03-121218 with confidence from acme-chip.com, 1 Year Warranty
HSB03-121218Quantity:1994
Part No | HSB03-121218 |
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Manufacturer | CUI Devices |
Description | HEAT SINK, BGA, 12 X 12 X 18 MM |
Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
Datasheets |
Specifications
Shape | Square, Pin Fins |
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Package | Tray |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.709" (18.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
Length | 0.472" (12.00mm) |
Thermal Resistance @ Natural | 24.01°C/W |
Material Finish | Black Anodized |
Attachment Method | Adhesive (Not Included) |
Width | 0.472" (12.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
Package Cooled | BGA |
Introduce
We can supply HSB03-121218 , send us a request quote to request HSB03-121218 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HSB03-121218.The price and lead time for HSB03-121218 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HSB03-121218.We look forward to working with you to establish long-term relations of cooperation