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See Product Specifications for product details.
Buy HSB06-181810 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB06-181810 with confidence from acme-chip.com, 1 Year Warranty
HSB06-181810Quantity:1820
Part No | HSB06-181810 |
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Manufacturer | CUI Devices |
Description | HEAT SINK, BGA, 18 X 18 X 10 MM |
Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
Datasheets |
Specifications
Shape | Square, Pin Fins |
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Package | Box |
Material | Aluminum Alloy |
Product Status | Active |
Fin Height | 0.394" (10.00mm) |
Series | HSB |
Type | Top Mount |
Thermal Resistance @ Forced Air Flow | 18.80°C/W @ 200 LFM |
Length | 0.709" (18.00mm) |
Thermal Resistance @ Natural | 23.68°C/W |
Material Finish | Black Anodized |
Attachment Method | Adhesive (Not Included) |
Width | 0.709" (18.00mm) |
Diameter | - |
Power Dissipation @ Temperature Rise | 3.2W @ 75°C |
Package Cooled | BGA |
Introduce
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