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Home > Products > Thermal > Heat Sinks > ///HSB06-181810

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HSB06-181810Quantity:1820

Part No HSB06-181810
Manufacturer CUI Devices
Description HEAT SINK, BGA, 18 X 18 X 10 MM
Lead Free Status / RoHS Status Contains lead / RoHS compliant
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Specifications

ShapeSquare, Pin Fins
PackageBox
MaterialAluminum Alloy
Product StatusActive
Fin Height0.394" (10.00mm)
SeriesHSB
TypeTop Mount
Thermal Resistance @ Forced Air Flow18.80°C/W @ 200 LFM
Length0.709" (18.00mm)
Thermal Resistance @ Natural23.68°C/W
Material FinishBlack Anodized
Attachment MethodAdhesive (Not Included)
Width0.709" (18.00mm)
Diameter-
Power Dissipation @ Temperature Rise3.2W @ 75°C
Package CooledBGA

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