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See Product Specifications for product details.
Buy HSB07-202009 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB07-202009 with confidence from acme-chip.com, 1 Year Warranty
HSB07-202009Quantity:1764
| Part No | HSB07-202009 |
|---|---|
| Manufacturer | CUI Devices |
| Description | HEAT SINK, BGA, 20 X 20 X 9 MM |
| Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
| Datasheets |
Specifications
| Shape | Square, Pin Fins |
|---|---|
| Package | Box |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.354" (9.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |
| Length | 0.787" (20.00mm) |
| Thermal Resistance @ Natural | 24.08°C/W |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive (Not Included) |
| Width | 0.787" (20.00mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Package Cooled | BGA |
Introduce
We can supply HSB07-202009 , send us a request quote to request HSB07-202009 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HSB07-202009.The price and lead time for HSB07-202009 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HSB07-202009.We look forward to working with you to establish long-term relations of cooperation
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