Images are for reference only.
See Product Specifications for product details.
Buy HSB01-080808 with confidence from acme-chip.com, 1 Year Warranty
See Product Specifications for product details.
Buy HSB01-080808 with confidence from acme-chip.com, 1 Year Warranty
HSB01-080808Quantity:3943
| Part No | HSB01-080808 |
|---|---|
| Manufacturer | CUI Devices |
| Description | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
| Lead Free Status / RoHS Status | Contains lead / RoHS compliant |
| Datasheets |
Specifications
| Shape | Square, Pin Fins |
|---|---|
| Package | Box |
| Material | Aluminum Alloy |
| Product Status | Active |
| Fin Height | 0.315" (8.00mm) |
| Series | HSB |
| Type | Top Mount |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
| Length | 0.335" (8.50mm) |
| Thermal Resistance @ Natural | 39.10°C/W |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive (Not Included) |
| Width | 0.335" (8.50mm) |
| Diameter | - |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Package Cooled | BGA |
Introduce
We can supply HSB01-080808 , send us a request quote to request HSB01-080808 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HSB01-080808.The price and lead time for HSB01-080808 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HSB01-080808.We look forward to working with you to establish long-term relations of cooperation
Related parts for HSB01-080808
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
|
HSB01-080808 | CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM | RFQ >> |
 |
HSB01-M292S01H050A | WITHWAVE CO LTD | High Speed Connector, 0.9 mm pit | RFQ >> |
| HSB0104YP-NTR-E | Renesas Electronics Corporation | DIODE SCHOTTKY BARRIER | RFQ >> | |
| HSB0104YPTL-E | Renesas Electronics Corporation | DIODE SCHOTTKY BARRIER | RFQ >> | |
 |
HSB0104YPTR | RENESAS | SOT343 | RFQ >> |
 |
HSB02-101007 | CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM | RFQ >> |
 |
HSB03-121218 | CUI Devices | HEAT SINK, BGA, 12 X 12 X 18 MM | RFQ >> |
 |
HSB03-141406 | CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM | RFQ >> |
 |
HSB04-171706 | CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM | RFQ >> |
 |
HSB05-171711 | CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M | RFQ >> |
 |
HSB06-181810 | CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM | RFQ >> |
 |
HSB07-202009 | CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM | RFQ >> |
 |
HSB08-212106 | CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM | RFQ >> |
 |
HSB09-212115 | CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM | RFQ >> |
