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Home > Products > Thermal > Pads, Sheets > ///HF115AC-0.0055-AC-105

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HF115AC-0.0055-AC-105Quantity:12403

Part No HF115AC-0.0055-AC-105
Manufacturer Bergquist
Description THERM PAD 36.83X21.29MM W/ADH
Lead Free Status / RoHS Status Lead Free / RoHS compliant
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Specifications

Thermal Conductivity:0.8 W/m-K
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Detailed Description:Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side
Adhesive:Adhesive - One Side
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:2 Weeks
Shape:Rectangular
Thermal Resistivity:0.35°C/W
Email:[email protected]
Outline:36.83mm x 21.29mm
Color:Gray
Series:Hi-Flow® 115-AC
Usage:SIP
Type:Pad, Sheet
Thickness:0.0055" (0.140mm)
Other Names:BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105
Material:Phase Change Compound
Backing, Carrier:Fiberglass

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We can supply HF115AC-0.0055-AC-105 , send us a request quote to request HF115AC-0.0055-AC-105 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number HF115AC-0.0055-AC-105.The price and lead time for HF115AC-0.0055-AC-105 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part HF115AC-0.0055-AC-105.We look forward to working with you to establish long-term relations of cooperation