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Home > Products > Thermal > Heat Sinks > ///BDN12-3CB/A01

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Part No BDN12-3CB/A01
Manufacturer CTS Thermal Management Products
Description HEATSINK CPU W/ADHESIVE 1.21"SQ
Lead Free Status / RoHS Status Contains lead / RoHS compliant
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Specifications

ShapeSquare, Pin Fins
PackageTray
MaterialAluminum
Product StatusActive
Fin Height0.355" (9.02mm)
SeriesBDN
TypeTop Mount
Thermal Resistance @ Forced Air Flow6.80°C/W @ 400 LFM
Length1.210" (30.73mm)
Thermal Resistance @ Natural19.60°C/W
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Included)
Width1.210" (30.73mm)
Diameter-
Power Dissipation @ Temperature Rise-
Package CooledAssorted (BGA, LGA, CPU, ASIC...)

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