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Home > Products > Thermal > Heat Sinks > ///BDN09-3CB/A01

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Part No BDN09-3CB/A01
Manufacturer CTS Thermal Management Products
Description HEATSINK CPU W/ADHESIVE .91"SQ
Lead Free Status / RoHS Status Contains lead / RoHS compliant
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Specifications

ShapeSquare, Pin Fins
PackageBox
MaterialAluminum
Product StatusActive
Fin Height0.355" (9.02mm)
SeriesBDN
TypeTop Mount
Thermal Resistance @ Forced Air Flow9.60°C/W @ 400 LFM
Length0.910" (23.11mm)
Thermal Resistance @ Natural26.90°C/W
Material FinishBlack Anodized
Attachment MethodThermal Tape, Adhesive (Included)
Width0.910" (23.11mm)
Diameter-
Power Dissipation @ Temperature Rise-
Package CooledAssorted (BGA, LGA, CPU, ASIC...)

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We can supply BDN09-3CB/A01 , send us a request quote to request BDN09-3CB/A01 pirce and lead time. acme-chip.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number BDN09-3CB/A01.The price and lead time for BDN09-3CB/A01 depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part BDN09-3CB/A01.We look forward to working with you to establish long-term relations of cooperation

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BDN09-3CB/A01 CTS Thermal Management Products HEATSINK CPU W/ADHESIVE .91"SQ