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Part No PA0187
Manufacturer Chip Quik Inc.
Description TO-263-9 DDPAK/D2PAK TO DIP-18 S
Lead Free Status / RoHS Status Contains lead / RoHS compliant
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Specifications

SeriesProto-Advantage
Package AcceptedTO-263 (DDPAK/D2PAK)
Number of Positions9
PackageBulk
Proto Board TypeSMD to DIP
Pitch0.038" (0.97mm)
MaterialFR4 Epoxy Glass
Size / Dimension0.700" x 1.000" (17.78mm x 25.40mm)
Product StatusActive
Board Thickness0.062" (1.57mm) 1/16"

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