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| Image | Part Number | Manufacturers | Description | Lead Free | RoHS | View |
|---|---|---|---|---|---|---|
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25CS640T-H/SN | Microchip Technology | 64KB SPI SERIAL EEPROM W/ECC, 8- | Contains Lead | compliant | RFQ >> |
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25CS640T-H/ST | Microchip Technology | 64KB SPI SERIAL EEPROM W/ECC, 8- | Contains Lead | compliant | RFQ >> |
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MX25R1635FZURH2 | Macronix | IC FLASH 16M SPI 80MHZ 8USON | Contains Lead | compliant | RFQ >> |
|
W25Q32RVSSJQ | Winbond Electronics | SPIFLASH, 32M-BIT, 4KB UNIFORM S | Contains Lead | compliant | RFQ >> |
|
W25Q32RVXHJQ TR | Winbond Electronics | SPIFLASH, 3V, 32M-BIT, 4KB UNIFO | Contains Lead | compliant | RFQ >> |
|
W25Q32RVSNJQ | Winbond Electronics | SPIFLASH, 32M-BIT, 4KB UNIFORM S | Contains Lead | compliant | RFQ >> |
|
MX25L3233FM1R-08Q | Macronix | IC FLASH 32MBIT SPI/QUAD 8SOP | Contains Lead | compliant | RFQ >> |
|
W25Q32RVZPJQ | Winbond Electronics | SPIFLASH, 32M-BIT, 4KB UNIFORM S | Contains Lead | compliant | RFQ >> |
 |
BR25G512FVT-5AE2 | Rohm Semiconductor | 512KBIT, SPI BUS, SERIAL EEPROM | Contains Lead | compliant | RFQ >> |
|
M24M02E-FMC6TG | STMicroelectronics | 2 MBIT SERIAL I2C BUS EEPROM WIT | Contains Lead | compliant | RFQ >> |
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24CSM01T-E/MS | Microchip Technology | 1MBIT 3.4MHZ I2C SERIAL EEPROM, | Contains Lead | compliant | RFQ >> |
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BR25G1MFJ-5AE2 | Rohm Semiconductor | 1024KBIT, SPI BUS, SERIAL EEPROM | Contains Lead | compliant | RFQ >> |
|
BR24H1MFJ-5ACE2 | Rohm Semiconductor | 1M BIT, IC (2-WIRE) BUS, HIGH SP | Contains Lead | compliant | RFQ >> |
|
BR25G1MFVT-5AE2 | Rohm Semiconductor | 1024KBIT, SPI BUS, SERIAL EEPROM | Contains Lead | compliant | RFQ >> |
 |
MX25L12833FM2Q-10G | Macronix | IC FLASH 128MBIT SPI/QUAD 8SOP | Contains Lead | compliant | RFQ >> |
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MX25L12833FXDQ-10G | Macronix | G IC FLASH 128MBIT SPI/QUAD | Contains Lead | compliant | RFQ >> |
|
23AA04M-I/ST | Microchip Technology | 4MBIT SERIAL SRAM, 1.7V-3.6V | Contains Lead | compliant | RFQ >> |
 |
23AA04M-I/P | Microchip Technology | 4MBIT SERIAL SRAM, 1.7V-3.6V | Contains Lead | compliant | RFQ >> |
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23LCV04M-I/ST | Microchip Technology | 4MBIT SERIAL SRAM, 2.2V-3.6V WIT | Contains Lead | compliant | RFQ >> |
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23LCV04M-I/P | Microchip Technology | 4MBIT SERIAL SRAM, 2.2V-3.6V WIT | Contains Lead | compliant | RFQ >> |
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W959D6NFKX4I | Winbond Electronics | 512MB HYPERRAM X16, 250MHZ, IND | Contains Lead | compliant | RFQ >> |
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W66AP6NBQAFJ | Winbond Electronics | 1GB LPDDR4, X16, 1600MHZ, -40C~1 | Contains Lead | compliant | RFQ >> |
|
MT29F8G08ABBCAH4-IT:C TR | Micron Technology Inc. | 256MX16 NAND FLASH DIE | Contains Lead | compliant | RFQ >> |
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W634GU6RB-11 | Winbond Electronics | 4GB DDR3L 1.35V SDRAM, X16, 933M | Contains Lead | compliant | RFQ >> |
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MX25UW51245GXDR00 | Macronix | IC FLASH 512MBIT SPI/QUAD 24BGA | Contains Lead | compliant | RFQ >> |
|
MT42L32M32D1HE-18 AAT:D | Micron Technology Inc. | IC MEMORY DRAM 1G 134FBGA | Contains Lead | compliant | RFQ >> |
|
MT42L16M32D1HE-18 AAT:E | Micron Technology Inc. | IC MEMORY DRAM 512M 134FBGA | Contains Lead | compliant | RFQ >> |
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FEMC008GSTE9-T14-16 | Flexxon Pte Ltd | XTRA III EMMC 5.1 8GB MLC DIAMON | Contains Lead | compliant | RFQ >> |
|
FEMC004GSTE9-T14-17 | Flexxon Pte Ltd | XTRA III EMMC 5.1 4GB PSLC DIAMO | Contains Lead | compliant | RFQ >> |
|
EMMC32G-TS0A-01001 | Kingston Technology | IC FLASH 256GBIT EMMC 153WFBGA | Contains Lead | compliant | RFQ >> |
|
EMMC32G-TS0A-01011 | Kingston Technology | IC FLASH 256GBIT EMMC 153WFBGA | Contains Lead | compliant | RFQ >> |
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EMMC32G-TS0A-01002 | Kingston Technology | EMMC 5.1 (HS400) 153B 32GB PSLC | Contains Lead | compliant | RFQ >> |
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FEMC004GSTE9-T13-17 | Flexxon Pte Ltd | XTRA III EMMC 5.1 4GB PSLC DIAMO | Contains Lead | compliant | RFQ >> |
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FEMC016GSTE9-T14-26 | Flexxon Pte Ltd | XTRA III EMMC 5.1 16GB MLC DIAMO | Contains Lead | compliant | RFQ >> |
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FEMC008GSTE9-T13-16 | Flexxon Pte Ltd | XTRA III EMMC 5.1 8GB MLC DIAMON | Contains Lead | compliant | RFQ >> |
|
FEMC016GSTE9-T13-26 | Flexxon Pte Ltd | XTRA III EMMC 5.1 16GB MLC DIAMO | Contains Lead | compliant | RFQ >> |
 |
MX66UW2G345GXRR00 | Macronix | IC FLASH 2GBIT SPI/QUAD 24CSPBGA | Contains Lead | compliant | RFQ >> |
|
FEMC128GBE-E340 | Flexxon Pte Ltd | AXO EMMC 5.1 128GB 3D TLC DIAMON | Contains Lead | compliant | RFQ >> |
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BY25Q20AWTIG(T) | BYTe Semiconductor | 2 MBIT, WIDE VCC (1.7V TO 3.6V), | Contains Lead | compliant | RFQ >> |
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BY25Q20BLAIG(R) | BYTe Semiconductor | 2 MBIT, 1.8V (1.65V TO 2.0V), -4 | Contains Lead | compliant | RFQ >> |
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BY25Q20BLZIG(R) | BYTe Semiconductor | 2 MBIT, 1.8V (1.65V TO 2.0V), -4 | Contains Lead | compliant | RFQ >> |
|
BY25D05ASTIG(T) | BYTe Semiconductor | 512 KBIT, 3.0V (2.7V TO 3.6V), - | Contains Lead | compliant | RFQ >> |
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BY25Q40GWUIG(R) | BYTe Semiconductor | 4MBIT, WIDE VCC (1.7V TO 3.6V), | Contains Lead | compliant | RFQ >> |
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BY25Q40BLSIG(T) | BYTe Semiconductor | 4 MBIT, 1.8V (1.65V TO 2.0V), -4 | Contains Lead | compliant | RFQ >> |
|
BY25Q40GWSIG(T) | BYTe Semiconductor | 4 MBIT, WIDE VCC (1.7V TO 3.6V), | Contains Lead | compliant | RFQ >> |
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BY25Q40GLSIG(T) | BYTe Semiconductor | 4 MBIT, 1.8V (1.65V TO 2.0V), -4 | Contains Lead | compliant | RFQ >> |
|
BY25D05ASTIG(R) | BYTe Semiconductor | 512 KBIT, 3.0V (2.7V TO 3.6V), - | Contains Lead | compliant | RFQ >> |
|
BY25D20ASTIG(R) | BYTe Semiconductor | 2 MBIT, 3.0V (2.7V TO 3.6V), -40 | Contains Lead | compliant | RFQ >> |
 |
BY25D05ASMIG(R) | BYTe Semiconductor | 512 KBIT, 3.0V (2.7V TO 3.6V), - | Contains Lead | compliant | RFQ >> |
|
BY25D20ASMIG(R) | BYTe Semiconductor | 2 MBIT, 3.0V (2.7V TO 3.6V), -40 | Contains Lead | compliant | RFQ >> |
