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| Image | Part Number | Manufacturers | Description | Lead Free | RoHS | View |
|---|---|---|---|---|---|---|
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RA-T2X-64E | Ohmite | TO-220 HEAT SINK | Contains Lead | compliant | RFQ >> |
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219-263A-TR | Wakefield-Vette | TO-263 HEAT SINK ANODZD REEL | Contains Lead | compliant | RFQ >> |
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C40-058-VE | Ohmite | HEATSINK FOR TO-247 TO-264 | Contains Lead | compliant | RFQ >> |
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D10650-40 | Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Contains Lead | compliant | RFQ >> |
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960-19-12-F-AB-0 | Wakefield-Vette | HEATSINK 19X12MM FRONT PUSH PIN | Contains Lead | compliant | RFQ >> |
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960-19-12-D-AB-0 | Wakefield-Vette | HEATSINK 19X12MM DIA PUSH PIN | Contains Lead | compliant | RFQ >> |
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ATS-P1-138-C2-R0 | Advanced Thermal Solutions Inc. | HEATSINK 25X25X15MM L-TAB T766 | Contains Lead | compliant | RFQ >> |
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SC1148 | Raspberry Pi | ACTIVE COOLER | Contains Lead | compliant | RFQ >> |
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APF19-19-13CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE | Contains Lead | compliant | RFQ >> |
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APF19-19-06CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE | Contains Lead | compliant | RFQ >> |
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C40-058-AE | Ohmite | HEATSINK FOR TO-247 TO-264 | Contains Lead | compliant | RFQ >> |
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APF19-19-10CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE | Contains Lead | compliant | RFQ >> |
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ATS-CPX060060006-205-C2-R0 | Advanced Thermal Solutions Inc. | HEATSINK 60X60X6MM XCUT CP | Contains Lead | compliant | RFQ >> |
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ATS-TI1OP-521-C1-R1 | Advanced Thermal Solutions Inc. | HEAT SINK FOR TI MOD #TPA3130D | Contains Lead | compliant | RFQ >> |
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APF30-30-06CB/A01 | CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE | Contains Lead | compliant | RFQ >> |
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ATS-56001-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK 19MM X 19MM X 9MM | Contains Lead | compliant | RFQ >> |
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ATS-54150D-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK 15MM X 15MM X 9.5MM | Contains Lead | compliant | RFQ >> |
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ATS-55150D-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK 15MM X 15MM X 9.5MM | Contains Lead | compliant | RFQ >> |
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901-19-2-12-2-B-0 | Wakefield-Vette | HEATSINK 19X19X12MM PIN | Contains Lead | compliant | RFQ >> |
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ATS-TI1OP-518-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK FOR TI MOD #TAS5611PHD | Contains Lead | compliant | RFQ >> |
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678-39-S | Wakefield-Vette | HEATSINK TO-220/TO-247 SCREW | Contains Lead | compliant | RFQ >> |
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ATS-X50250P-C1-R0 | Advanced Thermal Solutions Inc. | SUPERGRIP HEATSINK 25X25X17.5MM | Contains Lead | compliant | RFQ >> |
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395-1AB | Wakefield-Vette | HEATSINK 3X5X2.5" POWER/IGBT | Contains Lead | compliant | RFQ >> |
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ATS-X50290P-C1-R0 | Advanced Thermal Solutions Inc. | SUPERGRIP HEATSINK 29X29X17.5MM | Contains Lead | compliant | RFQ >> |
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ATS-X53400P-C1-R0 | Advanced Thermal Solutions Inc. | SUPERGRIP HEATSINK 40X40X17.5MM | Contains Lead | compliant | RFQ >> |
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ATS-X53450P-C1-R0 | Advanced Thermal Solutions Inc. | SUPERGRIP HEATSINK 45X45X17.5MM | Contains Lead | compliant | RFQ >> |
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ATS-56008-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK 50MM X 45MM X 16.5MM | Contains Lead | compliant | RFQ >> |
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395-2AB | Wakefield-Vette | HEATSINK 5.5X5X2.5" POWER/IGBT | Contains Lead | compliant | RFQ >> |
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ATS-61700W-C2-R0 | Advanced Thermal Solutions Inc. | FANSINK ASSEMBLY W/ MOUNTING HAR | Contains Lead | compliant | RFQ >> |
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ATS-56011-C1-R0 | Advanced Thermal Solutions Inc. | HEAT SINK 57.5 X 57.5 X 12.5MM | Contains Lead | compliant | RFQ >> |
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465K | Wakefield-Vette | HEAT SINK C2026 REV A | Contains Lead | compliant | RFQ >> |
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ATS-EXL121-300-R0 | Advanced Thermal Solutions Inc. | PCIE EXTRUSION PROFILE, AL6063 | Contains Lead | compliant | RFQ >> |
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ATS-EXL120-300-R0 | Advanced Thermal Solutions Inc. | PCIE EXTRUSION PROFILE, AL6063 | Contains Lead | compliant | RFQ >> |
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127765 | Wakefield-Vette | 6.39" WIDE X 36" FLATBACK HEATSI | Contains Lead | compliant | RFQ >> |
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512-9U | Wakefield-Vette | HEATSINK FOR PWR MOD/IGBT/RELAY | Contains Lead | compliant | RFQ >> |
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127761 | Wakefield-Vette | 5.86" X 36" FLATBACK HEATSINK 14 | Contains Lead | compliant | RFQ >> |
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127775 | Wakefield-Vette | 7.34" WIDE X 36" FLATBACK HEATSI | Contains Lead | compliant | RFQ >> |
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127757 | Wakefield-Vette | 4.461" WIDE X 36" FLATBACK HEATS | Contains Lead | compliant | RFQ >> |
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ATS-EXL1-1220-R0 | Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220X100X10MM | Contains Lead | compliant | RFQ >> |
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511-12M | Wakefield-Vette | HEATSINK FOR PWR MOD/IGBT/RELAY | Contains Lead | compliant | RFQ >> |
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ATS-EXL117-1220-R0 | Advanced Thermal Solutions Inc. | PCIE EXTRUSION PROFILE, AL6063 | Contains Lead | compliant | RFQ >> |
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ATS-PCB1065 | Advanced Thermal Solutions Inc. | HEATSINK TO-220 CLIP-ON BLACK | Contains Lead | compliant | RFQ >> |
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HSE12-B20-NP | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | Contains Lead | compliant | RFQ >> |
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ATS-PCBT1083 | Advanced Thermal Solutions Inc. | HEATSINK TO-220 BLACK | Contains Lead | compliant | RFQ >> |
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V2272E1 | ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, | Contains Lead | compliant | RFQ >> |
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HSS26-B20-P38 | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | Contains Lead | compliant | RFQ >> |
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HSS10-B20-P40 | CUI Devices | HEAT SINK, STAMPING, TO-220, 29. | Contains Lead | compliant | RFQ >> |
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HSS11-B20-P38 | CUI Devices | HEAT SINK, STAMPING, TO-220, 50. | Contains Lead | compliant | RFQ >> |
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V5274A-T | ASSMANN WSW Components | HEATSINK ALUM ANOD | Contains Lead | compliant | RFQ >> |
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V7237A | ASSMANN WSW Components | HEATSINK ALUM ANOD | Contains Lead | compliant | RFQ >> |
